Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications
Product Overview
Sapphire square raw wafer blanks are semi-finished single-crystal sapphire plates sliced directly from oriented sapphire boules. These blanks retain an as-cut, unpolished surface with natural saw marks and roughness, making them ideal for downstream precision processing including grinding, lapping, CMP polishing, thinning, and special-shape machining.
The material is α-Al₂O₃ single crystal, known for its exceptional hardness (Mohs 9), high thermal stability, strong chemical resistance, and wide optical transmission range. These characteristics make sapphire the preferred material for semiconductor wafers, optical windows, infrared components, and high-performance protective covers.
ZMSH provides sapphire raw blanks in a full range of dimensions, orientations, and thicknesses, offering complete customization according to customer processing requirements.
Key Characteristics
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Extreme Hardness (Mohs 9) — second only to diamond, scratch-resistant, wear-proof.
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Excellent Optical Transmission — covers 0.15–5.5 μm (UV–Visible–Infrared).
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High Thermal Stability — melting point 2053°C; withstands rapid thermal cycling.
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Chemical Inertness — insoluble in most acids and bases (except HF & hot H₃PO₄).
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Superior Electrical Insulation — stable dielectric properties at high temperatures.
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Low Defect Density — ideal for semiconductor and optoelectronic processing.
Technical Specifications
| Category | Specification |
| Crystal Material | Single Crystal Al₂O₃ |
| Crystal Structure | Trigonal (Hexagonal) |
| Orientation Options | C-plane (0001), A-plane (11-20), R-plane (1-102), M-plane (10-10), Custom |
| Size Range (Square) | 5 × 5 mm – 150 × 150 mm |
| Thickness Range | 0.2–10 mm (as-cut) |
| Surface Condition | As-Cut (Unpolished), optional Lapping/SSP/DSP |
| Surface Roughness (Ra) | As-cut: 0.5–2.0 µm (dependent on slicing) |
| Hardness (Mohs) | 9 |
| Density | 3.98 g/cm³ |
| Young’s Modulus | 345–400 GPa |
| Thermal Conductivity | 25–35 W/m·K @ 20°C |
| Melting Point | 2053°C |
| Coefficient of Thermal Expansion | 5.0–8.4 ×10⁻⁶ /K (orientation dependent) |
| Refractive Index | n₀=1.768, nₑ=1.760 |
| Optical Transmission Range | 0.15–5.5 μm |
| Dielectric Constant | 9.4–11.5 |
| Chemical Resistance | Excellent; resistant to most acids/alkalis |
| Electrical Resistivity | >10¹⁴ Ω·cm |
| Packaging | Class-100 cleanroom |
Applications
1. Semiconductor & LED Manufacturing
2. Optical & Infrared Components
3. Consumer Electronics
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Camera lens cover (after polishing)
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Fingerprint sensor covers
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Smartwatch & wearable cover plates
4. Industrial & Scientific
5. Aerospace & Defense
ZMSH Processing Capability
ZMSH provides end-to-end sapphire machining services:
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Crystal growth (KY/CZ)
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Orientation & slicing
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Lapping / grinding / thinning
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CMP super-polishing
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Chamfering & edge shaping
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Step, slot, hole, and custom-shape machining
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Ultra-thin & large-size sapphire processing
We provide one-stop solutions from raw blank to ready-to-use sapphire components.
FAQ
1. What is the difference between a raw wafer blank and a finished wafer?
A raw wafer blank is unpolished and retains as-cut roughness; finished wafers undergo precision grinding and CMP polishing.
2. Can the blank be customized?
Yes. Size, plane orientation, thickness, chamfering, and surface condition can all be customized.
3. Is sapphire suitable for infrared windows?
Yes. It has high transmittance from UV to mid-infrared (0.15–5.5 μm).
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Sapphire Square Raw Wafer Blank for Optical, Semiconductor, and High-Temperature Applications Images
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